The technical programme is constructed around three technological pillars as follows. The workshop is organized within the framework of the DigiFed project (www.digifed.org)
- Multi-domain LED package characterization:
- isothermal IVL measurements
- thermal measurement of LED packages
- Multi-domain LED package modelling for generic Spice simulators (such as LT Spice):
- chip level model
- compact thermal model of the physical package structure
- System (luminaire) level digital twinning for a digitalized design flow:
- thermal modelling of the physical structure of luminaires from MCAD designs
- use of multi-domain digital twin based luminaire virtual prototypes for design optimizations, beyond energy saving through temperature compensation