BME EET Digital Innovation HUB

Category: Design and testing support
Service type: Consultancy and implementation

Description of the service:
Estimation of the remaining useful lifetime (RUL) of power semiconductor devices such as LEDs or IGBTs is a hot topic. Digital twinning technologies are foreseen to support such prognostics tasks in an Industry 4.0 approach. To obtain sufficiently large set of reliability test data to setup the digital twins for operational environments is not a trivial task. Research is ongoing to involve AI techniques to bridge that gap. The service offered bridges the gap between SMEs and cutting edge research that BME EET is involved in.

Expected outcomes:
A methodology to create digital twins to support Industry 4.0 compliant operation of LED / power semiconductor component based systems / infrastructures through executable digital twins capable of considering the elapsed mission profiles of the critical components for predicting the RUL of the system. Based on the commonly agreed methodology tailored to the application needs the right digital twin can be created.

Typical case studies:
An LED luminaire with ageing and temperature compensated constant light output control where the digital twin plays an active role in the control mechanism.

Further info about the technical background.

Category: Design support
Service type: Consultancy and implementation

Description of the service:
BME-DIH offers the required testing, modelling and simulation capabilities completed related consulting services, including the technical support for the implementation. The subsequent images show such an LED luminaire engineering prototype, measured at BME’s thermal and reliability testing facility.

Expected outcomes:
With the comprehensive LED testing and modelling that we offer, important LED features not reported by LED vendors on their data sheets can also be considered in your design.

Typical case studies:
The overall LED digital twin based workflow is in use by a leading European based multinational lighting company and at a few French SME-s as well.

Further info: link

Category: Design support

Service type: Consultancy & implementation

Description of the service:
Thermal design consultancy and support for PCBs, servers and server rooms. Elaboration of electronics cooling solutions.

Expected outcomes:
A report of suggested design modifications, state-of-the-art, adaptive electronics cooling solutions, housing, packaging suggestions

Typical use cases:
High performance server racks with minimal form factors

Category: Design support

Service type: Consultancy

Description of the service:
System level design and hardware-software co-design of complex architectures, infrastructures, and databases. Implementation technology selection. Technical requirements formalization.

Expected outcomes:
Report of suggested design concept and implementation technologies

Category: Design support
Service type: Consultancy & implementation

Description of the service:
Thermal/electric/spectral multidomain modelling of photovoltaic cells and modules

Expected outcomes:
Software implemented models, reports

Typical use cases:
Power/operational predicion of photovltaic devices and PV plants

Category: Design support
Service type: Consultancy & implementation

Description of the service:
The service provides design consultancy and R&D support in the field heterogen integrated system. Special expertise can be focused on the thermal/cooling issues of such intgrated systems.

Expected outcomes:
Report of suggeted technical solutions, test specimen and prototype implementation, characterisation report

Category: Failure analysis
Service type: Consultancy and implementation

Description of the service:
Thermal performance characterisation from raw materials to components, be it a passive or an active, in-situ or prepared sample. We can compare different batches, help with warranty claims or just refine datasheet information. The method can be combned with other services of the Thermal, Optical and Reliability Laboratory, especially with Thermal imaging or with Reliability testing.

Expected outcomes:
The report can range from from a single Rth value to a detailed heatflow path evaluation with highlighting the thermally compromised layers, even with enhancement tips or technical ideas for future design updates.

Typical case studies:
Thermal performance characterisation of faulty or reference samples, reliability testing related structural monitoring

Category: Failure analysis
Service type: Consultancy and implementation

Description of the service:
Capturing temperature distribution on the die of decapsulated integrated circuits, on PCB and component level, inside junction boxes even at large scales as architectural level.

Expected outcomes:
The report can range from a single temperature value of interest, up to a set of thermal images or video recordings up to 100fps, with areas evaluated and data exported, backed up by highlights and remarks from our thermal experts.

Typical case studies:
Failure detection or analysis with thermal performance characterisation of faulty or reference samples

Category: Characterisation
Service type: Consultancy and implementation

Description of the service:
The reliability test environment integrates a set of appropriate hardware and software components built around the de facto industry standard Thermal Transient Tester (T3Ster) equipment of Siemens. The system monitors the electric, thermal or even optical parameters of the device under test during freely customizable test sequences.

Expected outcomes:
Test report with e.g. temperature and relative humidity logs, highlighted change in thermal performance, processed samples with predefined aging history.

Typical case studies:
Reliability tests on up from component level (RF modules, sensors, PSUs, drivers, LEDs, FETs) to project demonstrators. Typical use cases range from functional tests and real application environment simulations on IoT and CPS based devices, to thermally and moisture induced package and silicon level failure mode monitoring during lifetime tests.

Further info: link

Category: Design support
Service type: Consultancy and implementation

Description of the service:
Build-up of project demonstrators are backed-up by our 3D printing team to aid the design process and to ease the final steps before project evaluation.

Expected outcomes:
Structural or design elements printed with FDM or SLA technology.

Typical case studies:
Custom crafted sensor housings, sample holders, junction boxes, adapters.

Category: Technology access
Service type: Consultancy & implementation

Description of the service:
Processing of semiconductor samples in ISO Class 6 environment. Available process steps: litography, diffusion doping, high temperature steps, wet chemical processing, deposition of conductor and insulator layers, including characterisation techniques for the process steps.

Expected outcomes:
Technology/process report, processed samples/devices.

Category: Training
Service type: Education

Description of the service:
PDC for thermal experts who want to get deeper insight into selected areas of thermal transient testing and its applications

Expected outcomes:
Course and course material